Dynamic Filling Characteristics of a Capillary Driven Underfill Process in Flip-Chip Packaging
김종민, 이성혁, 신영의, 이형준
MATERIALS TRANSACTIONS, 201109
143
Biological Temperature Sensing of Focal Contacts
김종민, 최창경, J.Y.Chang, B.Plunger
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 201108
144
Flattening Characteristics of Ni20Cr Thermal-Sprayed Coating Layers on Preheated SCM415 Substrates
이성혁, 조민행, 김남일, 위재용, 신동환, 이재빈, 박승일, 김종민
MATERIALS TRANSACTIONS, 201107
145
Dispersion, hybrid interconnection and heat dissipation properties of functionalized carbon nanotubes in epoxy composites for electrically conductive adhesives (ECAs)
김종민, 김주헌, 권유미, 임병승
MICROELECTRONICS RELIABILITY, 201104
146
Mechanical and wetting properties of epoxy resins: Amine-containing epoxy-termicated siloxane oligomer with or without reductant
김종민, 김주헌, 권유미, 임병승
MICROELECTRONICS RELIABILITY, 201104
147
Characteristics of Isotropically Conductive Adhesive (ICA) Filled with Carbon Nanotubes (CNTs) and Low-Melting-Point Alloy Fillers
김종민, 임병승
MATERIALS TRANSACTIONS, 201012
148
Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding
김종민, 송용, 조민행, 이성혁, 신영의
MATERIALS TRANSACTIONS, 201010
149
Chemo-rheological characteristics of a self-assembling anisotropic conductive adhesive system containing a low-melting point solder
김종민, 장근수, 엄용성, 문종태, 백지원, 남재도
MICROELECTRONIC ENGINEERING, 201010
150
Reliability of Fine-Pitch Flip-Chip (COG) Bonding with Non-Conductive Film Using Ultrasonic Energy