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174
Electrical and mechanical characterization of an anisotropic conductive adhesive with a low melting point solder
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MICROELECTRONIC ENGINEERING, 200811
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Numerical Investigation on Self-Organized Interconnection Using Anisotropic Conductive Adhesive with Low Melting Point Alloy Filler
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실록산 올리고머가 ACA 용 DGEBF/ESTO-DDM 복합 레진의 경화 거동에 미치는 영향