2023

,

Effect of particle removal on Cu and oxide surface of PR in dicing process for die-to-wafer bonding

2022

,

Properties of various plasma surface treatments for oxide-oxide bonding in 3D integration

2022

,

Analysis of Cu-Cu wafer bonding using Ag nano passivation

2022

,

Low-temperature Cu-Cu wafer bonding using Ag nanolayer

2021

,

Characteristics of Ti Nano Passivation for Low Temperature Cu Bonding