발행물
컨퍼런스
ISMP
2018
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Characterization of Cu surfaces by plasma treatment for wafer bonding applications
IUMRS-ICEM
Study of photo-definable organic-inorganic spin-on dielectric use for FOWLP applications
KMRS-F
2017
Process Assessment of Spin-On-Glass in Wafer Level Packaging Interconnect
KCS 2018
ties of oxide semiconductor thin film on Si substrate
KMRS-F 2017