발행물
컨퍼런스
KCS 2015
2015
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Liquid cooling system with TSV for high power 3D packages
KMRAS 2015
The characteristics of liquid cooling module fabricated on Si wafer with micro-channel and TSV
KMRS 2015
Structural, electrical. and optical properties of SnO thin film grown by RF sputtering of SnO /Sn composite target
IITC MAM 2015
Experimental characterization of TSV liquid cooling for 3D integration
ISMP 2015
Tin oxide deposited via RF sputtering with SnO/Sn composite target