발행물
컨퍼런스
TCM 2016
2016
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Comparative analysis of SnOx thin films deposited by reactive sputtering in different SnO/Sn target compositions
ISMP 2016
Single-phase liquid cooling of silicon chips for high power density microelectronics
KCS 2016
Characteristics of micro-channel liquid cooling system with various metal heat spreaders and coolants
KMRS 2016
Effects of micro-channel liquid cooling with Cu or Ag bumps for IC thermal management
KSC 2015
2015
3D IC thermal management using Cu filled TSVs