발행물
컨퍼런스
IEEE EPTC
2019
,
Comparative Study of Plasma Treatment on Sputtered and Electroplated Cu Surfaces for Cu-to-Cu Bonding
ISMP-EMAP
Copper Nitride Passivation by Ar-N2 Two Step Plasma Treatments for Low-Temperature Copper Bonding
IEEE 3DIC
Characterization of nitride passivaed Cu surface for low temperature CU-Cu bon
IEEE LTB-3D
Effect of nitride passivation on Cu surface for low temperature Cu-to-Cu bonding
KCS
Study of Ar-N2 plasma treated Cu surface for low temperature Cu-Cu wafer bonding