발행물
컨퍼런스
The Korean Conference on Semiconductor 2021
2021
,
Cu-Cu Bonding using Optimized Copper Nitride Passivation for 3D Packaging Applications
IEEE IITC 2021
Effect of Titanium Thin Films on Low Temperature Copper Bonding
KMEPS 2021
Evaluation of Cu bonding using Ag nanolayer and their diffusion
ECS PRiME 2020
2020
Copper surface passivation for low temperature Cu-to-Cu bonding applications
IEEE ECTC 2020
Study of plasma treatments and planarization process for characteristics required for wafer-level Cu-to-Cu hybrid bonding