2020

,

Study of plasma treatments and planarization process for characteristics required for wafer-level Cu-to-Cu hybrid bonding

2020

,

Development of CMOS-compatible low temperature Cu bonding optimized by the response surface methodology

2020

,

Characterizations of copper nitride passivated surface for Cu bonding

2020

,

Persistence analysis of copper nitride passivation for Cu bonding application

2019

,

Plasma process optimization for Cu bonding integration using the design of experiment technique