발행물
컨퍼런스
ISMP 2017
2017
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Evaluation of spin-on dielectric for use in wafer level packaging interconnect
KMRS-S 2017
Effect of wet etching on various barrier materials for fine pitch redistribution layers
KMAPS 2017
Study of sputtered Ti/Cu barrier/seed etching for fine pitch EDG structures
KCS 2017
Micro-fabrication of Si liquid cooling structure and its thermal characteristic analysis
TCN 2016
2016
Effect of vacuum annealing on transparent SnOx thin films produced by sputtering of SnO/Sn composite target