발행물
컨퍼런스
Sematech Surface Preparation and Cleanin Conference
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Effects of Size, Humidity, and Aging on Particle Removal
Sematech Surface Preparation and Cleaning Conference
Effect of Shockwave on Particle Adhesion Force on Multilayer EUVL Mask
International Conference on Planarization/CMP Technology
Post-CMP Cleaning: Interaction between Particles and Surface
Collapse Behavior and Forces of Multi-stack Patterns
The 19th International Conference on Planarization/CMP Technology 2024
2024
Investigation of the Cross-Contamination Mechanism by PVA Brush Scrubbing Process and Parameters during Post-CMP Cleaning