발행물
컨퍼런스
The 19th International Conference on Planarization/CMP Technology 2024
2024
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Impact of CMP Slurry Additives on Copper Pad Corrosion and Surface Topography of Interest to Cu-Cu Hybrid Bonding
Investigation of the root cause of the scratch formation during copper post-CMP brush scrubbing
Investigation of silica particle and Mo ion contamination on PVA brush during Mo post-CMP cleaning process
PRiME 2024
Study of Chemical-Physical Cleaning Technologies for Better Particle Removal Trapped on the Crystal Defects of 4H-SiC
Surface Preparation and Cleaning Conference
Changes in Surface Chemical Characteristics of 4H-SiC for Better Cleaning Performance