발행물
컨퍼런스
한국반도체학술대회
2024
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Electrochemical Study on Better Controllability of Cu Pad Topography in Cu/Ti CMP Seonwoo
Differences in Surface Chemical Behavior and Cleaning Mechanism of Si and SiC
Study on the Chemical Durability and Defect Reduction Effects of Ceramic-Based CVD CMP Conditioners
Development of Physical Force-Assisted Wet Cleaning Process for Removing Highly Chemically Resistant Organic Residue
Korean International Semiconductor Conference on Manufacturing Technology 2023
2023
Investigation and Characterization of Mo Surface during Mo Post-CMP Cleaning Process