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컨퍼런스
대한용접접합학회 2019년도 추계학술발표대회
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전력반도체소자 접합용 Tri-modal Cu sintering paste의 접합특성 연구
Ni층 두께 및 Pd층 성분별 thin-ENEPIG 표면처리 Sn-3.0Ag-0.5Cu 솔더 접합부의 시효처리에 따른 계면 반응 및 기계적 신뢰성 평가
The 18th International Symposium on Microelectronics and Packaging (ISMP2018)
Effects of reaction time and Pd layer type on interfacial reactions and IMC morphologies of thin-Au/Pd/Ni surface finished PCBs with Sn-3.0Ag-0.5Cu solder joints
Sintering Study of Cu Micro/Nano-Particle Mixed Pastes for Power Semiconductor Bonding Applications
The 5th International Conference on Advanced Electromaterials (ICAE2019)
Electrical Characteristics of Sn-3.0Ag-0.5Cu/ENEPIG Solder Joints with Various Ni Layer Thickness under Electromigration Test