발행물
컨퍼런스
The 5th International Conference on Advanced Electromaterials (ICAE2019)
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Characteristics of the Transient Liquid Phase Sintering Joints Bonded by Ni-Sn Paste for High-temperature Applications
Fast Die-attach Bonding Using a Pre-annealed Sn/Cu/Sn Preform for High-temperature Power Module Applications
A Study of Micro/Nano Hybrid Cu Paste Sintering for Power Semiconductor Packaging
대한용접접합학회 마이크로접합 및 패키징 위원회(MPC 2019) 추계심포지움
Pd 성분 및 다양한 Ni(P) 층 두께의 thin-ENEPIG 표면처리 PCB와 Sn-3.0Ag-0.5Cu 솔더 접합부의 시효처리에 따른 계면 반응 및 기계적 특성평가
Materials Science & Technology 2019 (MS&T19)
Microstructure evolution in Cu and Ag coated Cu particle sintering for power module interconnection