발행물
컨퍼런스
한국마이크로전자 및 패키징학회 (KMEPS) 2019 춘계학술대회
201904
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고온 적용을 위한 Nickel-Tin Transient Liquid Phase Sintering 접합 소재 및 공정에 대한 연구
시효처리에 따른 다양한 Ni 층 두께의 thin-ENEPIG 표면처리 PCB와 Sn-3.0Ag-0.5Cu 솔더 접합부의 계면 반응 및 기계적 특성평가
The 20th Electronics Packaging Technology Conference (EPTC 2018)
A study of the growth rate of Cu-Sn intermetallic compounds for transient liquid phase bonding during isothermal aging
The 5th International Conference on Electronic Materials and Nanotechnology for Green Environment (ENGE2018)
Transient liquid phase sinter bonding of power device using Ni-Sn paste for power applications
Joining of power device and ceramic substrate using Cu nano paste for power electronic applications