발행물
컨퍼런스
The 17th International Symposium on Microelectronics and Packaging (ISMP2018)
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Various contents of Ni-coated Multi-walled Carbon Nanotubes reinforced Sn58%Bi solder joints under current stress
Interfacial reactions and shear strength of Sn-3.0Ag-0.5Cu/ENEPIG solder joints with different ENEPIG plating thickness and aging time
Feasibility Study of Various Cu-Sn Transient Liquid Phase Bonding for Power Electronics Applications
대한용접접합학회 마이크로접합 및 패키징 위원회(MPC 2018) 추계심포지움
201810
고온 전력모듈용 Ni-Sn TLP sintering 접합 특성 연구
International Union of Materials Research Societies-International Conference on Electronics Materials 2018 (IUMRS-ICEM 2018)
Power Device Bonding Technology for Electric Vehicle Applications