발행물
컨퍼런스
17th European Conference on Applications of Surface and Interface Analysis (ECASIA’17)
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Sequential interfacial reactions and mechanical strength of SAC305 solder joints with thin ENEPIG surface finishes
International Welding/Joining Conference-Korea 2017 (IWJC-Korea 2017)
Large-scale synthesis of uniform Ag nanowires with high-aspect-ratio and their application
Die bonding of power device using nano-sized Cu paste
한국마이크로전자 및 패키징학회 (KMEPS) 2017 춘계학술대회
201704
Copper-Tin을 이용한 전력반도체 고온다이접합용 Transient Liquid Phase Bonding 연구
The Korean Association of Microelectronics Packaging (KAMP) 2017 춘계심포지움
전기자동차 전력모듈용 고신뢰성 다이접합 기술 연구