발행물
컨퍼런스
International Conference on Electronic Materials and Nanotechnology for Green Environment (ENGE2016)
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TLP Bonding using Sn-Cu Solder and Cu Powder for Power Device Bonding
Fabrication of Ag Paste and Die Attach of Power Devices Using Ag Sintering
15th International Symposium on Microelectronics and Packaging (ISMP2016)
Die-attachment using Ag Paste for High Power Applications
Die-Attach Technology for High-Temperature Power Electronics Applications
Fabrication of Advanced Cu Pillar Bumps for High Reliable Fine Pitch Interconnections