발행물
컨퍼런스
The 4th International Conference on Advanced Electromaterials (ICAE2017)
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Study of Die Attach Technologies with Cu Nano Paste for High Temperature Power Electronics
The 16th International Symposium on Microelectronics and Packaging (ISMP2017)
A Study of Die attachment using nano-sized Cu paste for Power Electronics
Indium TLP bonding for High Performance Power Electronics Packaging
대한용접접합학회 마이크로접합 및 패키징 위원회(MPC 2017) 추계심포지움
201710
고온 전력모듈용 Ag & Cu sintering 다이접합 기술 신뢰성 평가
17th European Conference on Applications of Surface and Interface Analysis (ECASIA’17)
Interfacial reactions and mechanical strength of Au-In and Ag-In joints during transient liquid phase bonding