발행물
컨퍼런스
15th International Symposium on Microelectronics and Packaging (ISMP2016)
,
A study on Ni-Sn TLP Bonding for High Temperature Interconnections of Power Conversion Modules
대한용접접합학회 마이크로접합 및 패키징 위원회(MPC 2016) 추계심포지움
201610
전기자동차 전력모듈 고온 다이 접합용 Copper-Tin Transient Liquid Phase (TLP) Bonding
무연솔더의 동판 부식시험법
6th Electronics System-Integration Technology Conference (ESTC)
Comparative Study of Nickel-Tin and Copper-Tin Transient Liquid Phase Bondings for Power Electronics Packaging
한국마이크로전자 및 패키징학회 (KMEPS) 2016 춘계학술대회
High Temperature Die Attach Technologies for Power Device Packaging