발행물
컨퍼런스
20th International Union of Materials Research Societies-International Conference in Asia (IUMRS-ICA)
,
Fast Reaction of Cu-Sn TLP Joints Bonded using Pre-annealed Sn/Cu/Sn Composite Preform for High-temperature Applications
3rd International Conference on Applied Surface Science (ICASS)
Joining of power device and ceramic substrate using Sn-coated Cu micro paste for high-temperature applications
Initial reactions of phosphorous contained Pd layer in the thin-ENEPIG surface finished PCB with Sn-3.0Ag-0.5Cu solder joints
대한용접접합학회 2019년도 춘계학술발표대회
시효처리에 따른 다양한 Ni 층 두께와 Pure Pd 및 Pd-P층의 thin-ENEPIG 표면처리 PCB와 Sn-3.0Ag-0.5Cu 솔더 접합부의 계면반응 및 기계적 특성평가
고온 전력반도체 접합용 Sn/Cu/Sn 프리폼 제조 및 접합에 대한 연구