발행물
컨퍼런스
한국전기전자재료학회 2005년 하계학술대회
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Cu CMP에서 스틱-슬립 마찰과 스트래치에 관한 연구
ICMMD 2005
A Study on the Characteristics of Pad Conditioning in CMP
International Conference on Leading Edge Manufacturing in 21st Century
Tribological Effect of Abrasives on Material Removal in Oxide CMP
2009 International Conference on Planarization/CMP Technology
Measurement and Analysis of Pad Wear Profile due to Conditioning Process in Double Side Polishing
A Simulation of Material Removal Profile for Copper Chemical Mechanical Polishing