,

Si 웨이퍼 연마에 영향을 미치는 슬러리 특성 연구

,

MONITORING OF BREAK-IN TIME IN SI WAFER POLISHING

,

INFLUENCE OF PAD SURFACE STRUCTURE ON CMP PERFORMANCES IN SHALLOW TRENCH ISOLATION

,

CORRELATION BETWEEN PAD ROUGHNESS AND FRICTIONAL BEHAVIOR IN CHEMICAL MECHANICAL POLISHING

,

PAD ROUGHNESS VARIATION AND ITS EFFECT ON MATERIAL REMOVAL PROFILE OF CERIA BASED SLURRY DURING OXIDE CMP