발행물
컨퍼런스
The 1st International Symposium on Hybrid Materials and Processing
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Experimental Analysis of CMP Mechanism for Lithium Niobate Substrate
한국전기전자재료학회 2007 추계학술대회
전력 소자용 후막 구리 구조물의 평탄화
AE를 이용한 CMP 공정 감시에 관한 연구
2006 International Conference on Planarization/CMP Technology
Effect of Abrasive and Complexing Agent on Uniformity in Cu CMP
2009 International Conference on Planarization/CMP Technology
Classification of Chemical and Mechanical Balance in CMP for Electronic Materials