발행물

논문
특허
저서
컨퍼런스

전체 논문

174

11

Simulation and experimental analysis of abrasive fluidized bed machining process
Taekyoung Kim, Hyunseop Lee
Journal of Mechanical Science and Technology, 2020

12

Semi‑empirical Material Removal Model with Modified Real Contact Area for CMP
Hyunseop Lee
International Journal of Precision Engineering and Manufacturing, 2019

13

Surface Activation by Electrolytically Ionized Slurry during Cu CMP
Dasol Lee, Hyunseop Lee, Seonho Jeong, Minjong Yuh, Haedo Jeong
ECS Journal of Solid State Science and Technology, 2019

14

Investigation of pad wear in CMP with swing-arm conditioning and uniformity of material removal
Hyunseop Lee, Sangjik Lee
Precision Engineering, 2017

15

Material Removal Model of Lap Grinding for Sapphire Substrate Based on Roughness Parameters
Hyunseop Lee, Taekyung Lee
Materials Science Forum, 2017

16

Estimating the mechanical properties of polyurethane-impregnated felt pads
Dasol Lee, Hyunseop Lee
Journal of Mechanical Science and Technology, 2017

17

Electrochemical Analysis of the Slurry Composition for Chemical Mechanical Polishing of Flexible Stainless-Steel Substrates
Dasol Lee, Hyunjin Kim, Byeongjun Pak, Doyeon Kim, Haedo Jeong, Hyunseop Lee
Journal of Friction and Wear, 2017

18

Environmental Impact of Concentration of Slurry Components in Thick Copper CMP
Hyunseop Lee
INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING-GREEN TECHNOLOGY, 2017

19

Slurry Components in Metal Chemical Mechanical Planarization (CMP) Process: A Review
Dasol Lee, Hyunseop Lee, Haedo Jeong
INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, 2016

20

Mechanical Aspects of the Chemical Mechanical Polishing Process: A Review
Hyunseop Lee, Dasol Lee, Haedo Jeong
INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, 2016