발행물

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특허
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컨퍼런스

전체 논문

174

41

Application of electrolytic in-process dressing (ELID) grinding and chemical mechanical polishing (CMP) process for emerging hard–brittle materials used in light-emitting diodes
Hyunseop Lee, Hiroshi Kasuga, Hitoshi Ohmori, Hojun Lee, Haedo Jeong
Journal of Crystal Growth, 2011

42

Research on CMP Characteristics Attribute to Groove Size
Yongchang Guo, Youngkyun Lee, Hyunseop Lee, Haedo Jeong
Advanced Materials Research, 2011

43

Effect of mechanical factor in uniformity for electrochemical mechanical planarization
Sukhoon Jeong, Jaehyun Bae, Hyunseop Lee, Hojun Lee, Youngkyun Lee, Boumyoung Park, Hyoungjae Kim, Sungryul Kim, Haedo Jeong
Sensors and Actuators A, 2010

44

Chemical Mechanical Polishing of a Ti-Si-N Nanocomposite and AFM Study on Its Nanostructure
Hyunseop Lee, Doo-In Kim, Haedo Jeong, Kwang Ho Kim
Journal of the Korean Physical Society, 2010

45

Hybrid polishingmechanismof single crystal SiC usingmixed abrasive slurry(MAS)
H.S. Lee, D.I. Kim, J.H. An, H.J. Lee, K.H. Kim, H. Jeong
CIRP Annals - Manufacturing Technology, 2010

46

Effect of additives for higher removal rate in lithium niobate chemical mechanical planarization
Sukhoon Jeong, Hyunseop Lee, Hanchul Cho, Sangjik Lee, Hyoungjae Kim, Sungryul Kim, Jaehong Park, Haedo Jeong
Applied Surface Science, 2010

47

The Effect of PVA Brush Scrubbing on Post CMP Cleaning Process for Damascene Cu Interconnection
Hanchul Cho, Youngmin Kim, Hyunseop Lee, Sukbae Joo, Haedo Jeong
Solid State Phenomena, 2009

48

Mechanical effect of process condition and abrasive concentration on material removal rate profile in copper chemical mechanical planarization
Hyunseop Lee, Boumyoung Park, Haedo Jeong
Journal of Materials Processing Technology, 2009

49

Mechanical effect of colloidal silica in copper chemical mechanical planarization
Hyunseop Lee, Sukbae Joo, Haedo Jeong
Journal of Materials Processing Technology, 2009

50

Experimental Investigation of Material Removal Characteristics in Silicon Chemical Mechanical Polishing
Boumyoung Park, Sukhoon Jeong, Hyunseop Lee, Hyoungjae Kim, Haedo Jeong, David A. Dornfeld
Japanese Journal of Applied Physics, 2009