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전체 논문

174

51

Chemical and mechanical balance in polishing of electronic materials for defect-free surfaces
H.S. Lee, H.D. Jeong
CIRP Annals - Manufacturing Technology, 2009

52

The Effect of Mixed Abrasive Slurry on CMP of 6H-SiC Substrate
Hojun Lee, Beomyoung Park, Hyunseop Lee, Sukhoon Jeong, Heondeok Seo, Sukbae Joo, Haedo Jeong, Hyoungjae Kim
Materials Science Forum, 2008

53

Influence of slurry components on uniformity in copper chemical mechanical planarization
Hyunseop Lee, Boumyoung Park, Haedo Jeong
Microelectronic Engineering, 2008

54

Pad roughness variation and its effect on material removal profile in ceria-based CMP slurry
Boumyoung Park, Hyunseop Lee, Kihyun Park, Hyoungjae Kim, Haedo Jeong
Journal of Materials Processing Technology, 2008

55

Effect of Process Parameters on Friction Force and Material Removal in Oxide Chemical Mechanical Polishing
Boumyoung PARK, Hyunseop LEE, Youngjin KIM, Hyoungjae KIM, Haedo JEONG
Japanese Journal of Applied Physics, 2008

56

Chemical Mechanical Planarization Method for Thick Copper Films of Micro-Electro-Mechanical Systems and Integrated Circuits
Hyunseop LEE, Sukbae JOO, Hyoungjae KIM, Haedo JEONG
Japanese Journal of Applied Physics, 2008

57

The Characteristics of Frictional Behavior in CMP Using An Integrated Monitoring System
H.S. Lee, B.Y. Park, S.M. Park, H.J. Kim, H.D. Jeong
Key Engineering Materials, 2007

58

An Analysis of Edge Chipping in LiTaO3 Wafer Grinding Using a Scratch Test and FEA Simulation
이현섭, 황해성, 한승호
Lubricants, 2023

59

Tribological Study on Photocatalysis-Assisted Chemical Mechanical Polishing of SiC
Lubricants, 2023

60

Material Removal Characteristics of Abrasive-Free Cu Chemical-Mechanical Polishing (CMP) Using Electrolytic Ionization via Ni Electrodes
이현섭
Micromachines, 2023