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전체 논문

174

61

Electrolytically Ionized Abrasive-Free CMP (EAF-CMP) for Copper
이현섭, 박성
APPLIED SCIENCES-BASEL, 2021

62

Contact-Area-Changeable CMP Conditioning for Enhancing Pad Lifetime
이현섭, 손준규
APPLIED SCIENCES-BASEL, 2021

63

Hybrid CMP Slurry Supply System Using Ionization and Atomization
이현섭, 조호성, 이다솔, 정선호, 정해도
APPLIED SCIENCES-BASEL, 2021

64

Preliminary Study on Polishing of SLA 3D-Printed ABS-like Resin for Surface Roughness and Glossiness Reduction
이현섭, 손준규
Micromachines, 2020

65

Preliminary Study on Fluidized Bed Chemical Mechanical Polishing (FB-CMP) Process for Stainless Steel 304 (SS304)
이현섭, 김태경
ICROMACHINE, 2020

66

Surface Activation by Electrolytically Ionized Slurry during Cu CMP
이다솔, 이현섭, 정선호, 유민종, 정해도
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2019

67

Electrochemical Analysis of the Slurry Composition for Chemical Mechanical Polishing of Flexible Stainless-Steel Substrates
Lee, H (Lee, Hyunseop), Jeong, H (Jeong, Haedo), Kim, D (Kim, Doyeon), Kim, H (Kim, Hyunjin), Lee, D (Lee, Dasol), Pak, B (Pak, Byeongjun)
JOURNAL OF FRICTION AND WEAR, 2017

68

Investigation of pad wear in CMP with swing-arm conditioning and uniformity of material removal
Lee, H (Lee, Hyunseop), Lee, S (Lee, Sangjik)
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY, 2017

69

Effect of Citric Acid in Chemical Mechanical Polishing (CMP) for Lithium Tantalate (LiTaO3) Wafer
이현섭
Advanced Materials Research, 2016

70

Experimental investigation of process parameters for roll-type linear chemical mechanical polishing (Roll-CMP) system
Lee, H (Lee, Hyunseop), Wang, H (Wang, Han), Park, J (Park, Jaehong), Jeong, H (Jeong, Haedo)
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY, 2014