Semi-empirical material removal rate distribution model for SiO2 chemical mechanical polishing (CMP) processes
Lee, HS (Lee, H. S.), Jeong, HD (Jeong, H. D.), Dornfeld, DA (Dornfeld, D. A.)
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY, 2013
72
Macroscopic and Microscopic Investigation on Chemical Mechanical Polishing of Sapphire Wafer
Lee, H, Jeong, H, Choi, S, Lee, Y, Jeong, M
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2012
73
Effect of Process Parameters on Particle Removal Efficiency in Poly(vinyl alcohol) Brush Scrubber Cleaning
An, J, Lee, H, Kim, H, Jeong, H
JAPANESE JOURNAL OF APPLIED PHYSICS, 2012
74
Prediction of Real Contact Area from Microtopography on CMP Pad
Jeong, H (Jeong, Hobin), Lee, H (Lee, Hyunseop), Choi, S (Choi, Sungha), Lee, Y (Lee, Youngkyun), Jeong, H (Jeong, Haedo)
JOURNAL OF ADVANCED MECHANICAL DESIGN SYSTEMS AND MANUFACTURING, 2012
75
Application of electrolytic in-process dressing (ELID) grinding and chemical mechanical polishing (CMP) process for emerging hard-brittle materials used in light-emitting diodes
Lee, H (Lee, Hyunseop), Kasuga, H (Kasuga, Hiroshi), Ohmori, H (Ohmori, Hitoshi), Lee, H (Lee, Hojun), Jeong, H (Jeong, Haedo)
JOURNAL OF CRYSTAL GROWTH, 2011
76
A wafer-scale material removal rate profile model for copper chemical mechanical planarization
Lee, H, Jeong, H
INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2011
77
Effect of mechanical factor in uniformity for electrochemical mechanical planarization
Jeong, S, Bae, J, Lee, H, Lee, Y, Park, B, Kim, H, Kim, S, Jeong, H
SENSORS AND ACTUATORS A-PHYSICAL, 2010
78
Effect of additives for higher removal rate in lithium niobate chemical mechanical planarization
Jeong, S, Lee, H, Cho, H, Lee, S, Kim, H, Kim, S, Park, J, Jeong, H
APPLIED SURFACE SCIENCE, 2010
79
Hybrid polishing mechanism of single crystal SiC using mixed abrasive slurry (MAS)
Lee, HS (Lee, H. S.), Kim, DI (Kim, D. I.), An, JH (An, J. H.), Lee, HJ (Lee, H. J.), Kim, KH (Kim, K. H.), Jeong, H (Jeong, H.)
CIRP ANNALS-MANUFACTURING TECHNOLOGY, 2010
80
Mechanical effect of colloidal silica in copper chemical mechanical planarization
Lee, H (Lee, Hyunseop), Joo, S (Joo, Sukbae), Jeong, H (Jeong, Haedo)