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31
Effect of wafer size on material removal rate and its distribution in chemical mechanical polishing of silicon dioxide film
Hyunseop Lee,, Yeongbong Park, Sangjik Lee, Haedo Jeong
Journal of Mechanical Science and Technology, 2013
32
Effect of Contact Angle between Retaining Ring and Polishing Pad on Material Removal Uniformity in CMP Process
Yeongbong Park, Hyunseop Lee, Youngkyun Lee, Sunjoon Park, Haedo Jeong
INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, 2013
33
Effect of Heat According to Wafer Size on the Removal Rate and Profile in CMP Process
Yeongbong Park, Youngkyun Lee, Hyunseop Lee, Haedo Jeong
Electron. Mater. Lett., 2013
34
Macroscopic and Microscopic Investigation on Chemical Mechanical Polishing of Sapphire Wafer
Hyunseop Lee, Hojun Lee, Hobin Jeong, Sungha Choi, Youngkyun Lee, Moonki Jeong, Haedo Jeong
Journal of Nanoscience and Nanotechnology, 2012
35
Effect of Process Parameters on Particle Removal Efficiency in Poly(vinyl alcohol) Brush Scrubber Cleaning
Joonho An, Hyunseop Lee, Hyoungjae Kim, Haedo Jeong
Japanese Journal of Applied Physics, 2012
36
Prediction of Real Contact Area from Microtopography on CMP Pad
Hobin JEONG, Hyunseop LEE, Sungha CHOI, Youngkyun LEE, Haedo JEONG
Journal of Advanced Mechanical Design, Systems, and Manufacturing, 2012
37
Effect of Pad Groove Geometry on Material Removal Characteristics in Chemical Mechanical Polishing
Yongchang Guo, Hyunseop Lee, Youngkyun Lee, Haedo Jeong
INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, 2012
38
Temperature Distribution in Polishing Pad during CMP Process: Effect of Retaining Ring
Hyunseop Lee, Yongchang Guo, Haedo Jeong
INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, 2012
39
A wafer-scale material removal rate profile model for copper chemical mechanical planarization
Hyunseop Lee, Haedo Jeong
International Journal of Machine Tools & Manufacture, 2011
40
Chemical Mechanical Planarization of Copper Bumps on Printed Circuit Board
MoonKi Jeong, SeungJae Jo, HyunSeop Lee, AhReum Lee, ChungYun Kang, JinWon Choi, JinHo Kim, HaeDo Jeong
INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, 2011
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