발행물
컨퍼런스
41st Thchnical Meeting of Korea CMPUGM
2009
,
Post CMP Defects, its Effect on CMP Sustainability
MRS
Friction and Removal Rate Studies Using Diluted Ceria and Colloidal Silica Abrasive Slurries
The 9th Cleaning Technology Symposium of Korea SCUGM
Semiconductor FEOL Surface Preparation Overview
2009 K-MEMS
Fabrication of Higly Sensitive Pre-Patterned Microarray Chip and Characterization of Hydrophobic layer
SPCC 2009
Characterization of Hydrogen Dissolved DI Water for Particle Removal