발행물
컨퍼런스
80th Korea CMPUGM Technical Meeting
2024
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Investigation of the Cross-Contamination Mechanism by PVA Brush Scrubbing Process and Parameters during Post-CMP Cleaning
KISM 2024
Effect of pH and Dissolved Oxygen Levels on the Efficiency of Corrosion Inhibitors for Molybdenum during the CMP Process
Study on Scratch Generation during Copper Post-CMP Brush Cleaning for Sub-10 nm Semiconductor Manufacturing Devices
Investigating the Role of Benzotriazole on Silica and Copper Ions Loading to Polyvinyl Acetal (PVA) Brush during Copper Post-CMP Cleaning
ICPT 2024
Impact of CMP Slurry Additives on Copper Pad Corrosion and Surface Topography of Interest to Cu-Cu Hybrid Bonding