발행물
컨퍼런스
IMAPS Symposium 2024
2024
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Investigation on the Effects of Slurry Additives and Pad Morphology in Cu CMP for Hybrid Cu Bonding
The Surface Preparation and Cleaning Conference 2024
Effect of SDS Surfactant in H2 DIW on Cavitation Bubble Dynamics in Ultrasonic and Megasonic Fields
Changes in Surface Chemical Characteristics of 4H-SiC for Better Cleaning Performance
제 31회 한국반도체학술대회 The 31st Korean Conference on Semiconductors (KCS 2024)
Development of Physical Force-Assisted Wet Cleaning Process for Removing Highly Chemically Resistant Organic Residue
Differences in Surface Chemical Behavior and Cleaning Mechanism of Si and SiC