발행물
컨퍼런스
KISM, 2022
2022
,
Mechanism of PVA brush loading with colloidal silica and metal ions during Cu post-CMP cleaning
Post CMP Cleaning; Its Trend and Challenges
Effect of Scrubbing Parameters on Mechanical Properties and Wafer Cleaning during Post-CMP PVA Brush Cleaning
MRSK, November 2022
Investigation of ceria-PVA brush chemical interaction leading to cross-contamination issues in post-CMP cleaning
Effect of Ti ions on PVA brush loading with colloidal silica during W post-CMP cleaning