발행물
컨퍼런스
한국전기전자재료학회 추계발표
2007
,
Post Ru CMP Cleaning에서 연마입자의 흡착과 제거에 대한 chemical의 첨가제에 따른 영향
ICPT
Post-CMP Cleaning: Interaction between Particles and Surfaces
Effect of Diamonds on Pad Recovery in Oxide and Metal Pad Conditioning Process
Development of Post Ru CMP Cleaning Solutions
Effect of Slurry pH on Poly Silicon CMP