발행물
컨퍼런스
Summer Conference of KIEEM
2007
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Effect of Organic wax residues and particles removal by DIO3 (ozonated DI water) after silicon wafer batch polishing process
Summer Conference of KIEEME
Effect of pH adjustors in slurry on Ru CMP
Summer of KIEEME
Optimization of Electrolytes on Cu ECMP Process
The Effect of Additives in post Ru CMP Cleaning
Spring Conference of KMRS
Characterization of Fluorocarbon Thin Film for Application of Electro-Wetting