발행물
컨퍼런스
MRS2007 Spring meeting
2007
,
Effect of Additives in KOH Based Electrolytes on Cu ECMP
Development and Optimization of Slurry for Ru CMP
Effect of Wettability of Poly silicon on CMP Behavior
Fundamental of Post-CMP Cleaning
The 9th Korean MEMS Conference
Characterization of Anti-adhesion Layer made by Vapor SAM(self assembly monolayer) for Nanoimprint Lithography using Friction Force Measurements