발행물
컨퍼런스
Fall Conference of KMRS
2006
,
Characterization of Electrolytes and Effects of Additives in Cu ECMP
The Electrochemical Society
Reduction of Defects after Poly Si CMP with Oxide Slurry
Effect of Poly Silicon Wettability on Organic Type Defects in Poly CMP
2006 International EUVL Symposium
Removal of Nano Particles on EUV Mask Buffer and Absorber Layers by Laser Shockwave Cleaning
ICPT (International Conference on Planarization/CMP Technology)
Effect of Diamond Shape, Density and Size on Pad Conditioning