발행물
컨퍼런스
ICPT (International Conference on Planarization/CMP Technology)
2006
,
Characterization of Electrolyte on Cu Electrochemical Mechanical Planarization
IUMRS
The effect of implantation dose on the abnormal growth of polysilicon on substrate contaminated by Cu ion
Proceeding of the KIEEME Annual Summer Conference
Characterization of Electrolyte in Electrochemical Mechanical Planarization
Development of Tungsten CMP(Chemical Mechanical Planarization) Slurry using New Abrasive Particle
The Adhesion of Abrasive Particle during Poly-Si, TEOS and SiN CMP