발행물
컨퍼런스
12th Electronics Packaging Technology Conference (EPTC 2010)
,
Thermo-compression Bonding of Electrodes between FPCB and RPCB
대한용접접합학회 2010년도 춘계학술발표대회
201005
항온항습 조건하에서 Cr 층의 두께에 따른 FCCL의 접합 신뢰성 평가
Materials for Advanced Metallization (MAM 2010)
Effect of Thermal Treatment on Adhesion Strength of Cu/Ni-Cr/Polyimide Flexible Copper Clad Laminate Fabricated by Roll-to-Roll Process
TMS 2010, 139th Annual Meeting & Exhibition
A Study on the Microstructure Evolution of Cu/Sn/Cu Bonding Stacks during Bonding and Their Mechanical Properties for the Applications of 3D Packaging
대한용접접합학회 2009년도 추계학술발표대회
200911
항온항습 조건하에서 Ni/Cr 층의 두께에 따른 FCCL의 접합 신뢰성 평가