발행물
컨퍼런스
2009 대한용접접합학회 춘계학술발표대회
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ENIG/Sn-3.5Ag/ENIG solder joint의 전기적, 기계적 신뢰성에 관한 연구
International Conference on Advanced Computational Engineering and Experimenting (ACE-X 2008)
Bending Fatigue Characteristic for Au Bump Package with Adhesive Material
ICU (International Congress on Ultrasonics)
Effect of bonding parameters on ultrasonic flip chip bonding of Au-to-Cu interconnection
Characteristic of gold to tin interconnection fabricated by ultrasonic flip chip bonding
2007 MICRO-JOINING 춘계 심포지움
전자 패키지의 특성 및 신뢰성 평가