,

AEM observation of interfacial reaction layers formed between Sn-3.5Ag solder and ENIG plated Cu substrate

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Interfacial Reaction of Cu/Sn-Ag/ENIG Sandwich Solder Joint During Aging

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Correlation between Interfacial Reactions and Shear Strengths of Sn-Ag-(Cu and Bi-In)/ENIG plated Cu Solder Joints

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Coupling effect of Cu(ENIG)/Sn-Ag-(Cu)/Cu(ENIG) sandwich solder joint

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Interfacial reactions between Au-20Sn solder and Cu substrate with or without ENIG plating layer