,

Sn-Zn 무연솔더를 사용한 BGA패키지의 계면반응 및 신뢰성 평가

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Sn-Zn/ENIG 솔더 접합부의 계면반응 및 기계적 신뢰성

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Interfacial Reactions and Joint Reliability of Sn-9Zn Solder on Cu or Electrolytic Au/Ni/Cu BGA Substrate

,

TEM Observation of Interfacial Layers Formed Between Pb-free Sn-Ag Solder and ENIG Substrate

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Study of the Interfacial Reaction and Shear Strength of Pb-Free Sn-3.5Ag/Ni BGA Solder Joints during Reflow