,

Interfacial reaction of ENIG/Sn-Ag-Cu/ENIG sandwich solder joint during isothermal aging

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TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate

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표면실장 적용을 위한 Sn-Zn 무연 솔더의 신뢰성 연구

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Characteristic Analysis of Electroless Ni Plating layer for Electronic Packaging

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Interfacial Reactions between In-48Sn Solder and Electroless Nickel/Immersion Gold Substrate during Reflow Process