,

Characteristic evaluation of electroless nickel-phosphorus deposits with different phosphorus content

,

Investigation of interfacial reaction between Au-Sn solder and Kovar for hermetic sealing application

,

Fabrication and Reliability Evaluation of Au-Sn Flip Chip Solder Joint

,

Characterization of Interfacial Reaction Layers Formed between Sn-3.5Ag Solder and Electroless Ni-P Substrate

,

Fabrication of Ni Metal Mask with Fine Pitch by Electroforming Process