발행물
컨퍼런스
2006 대한용접학회 춘계학술발표대회
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Reliability evaluation of Pb-free solder joint with immersion Ag-plated Cu substrate
2006 대한금속재료학회 춘계학술발표대회
Fluxless Soldering Using Co-electroplated Au-Sn Alloy
2006 대한금속재료학회 춘계학술 발표대회
Solid-State Interfacial Reaction between Pb-free Solder and ENIG during High Temperature Storage Test
2006 춘계 한국세라믹학회
Evaluation of Mechanical and Electrical Reliabilities for Flip-Chip and BGA Packages
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP of MEMS
Au-Sn Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications