,

Morphology and thermal stability of electroless nickel-phosphorus plating layer

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Au-20Sn과 Au-90Sn 플립칩 솔더 범프의 접합부 신뢰성 비교

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A study on phase transformation and thermal stability of electroless nickel???phosphorus plating layer for electronic package

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Thermal reliability study on Au-Sn flip chip solder bump for packaging in optoelectronic application

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Isothermal aging effects on the interfacial reaction and shear strength of Sn3.5Ag0.7Cu/immersion Ag plated Cu joint