발행물

전체 논문

398

111

Effect of Displacement Rate on Bump Shear Properties of Electroplated Solder Bumps in Flip Chip Package
Ja-Myeong Koo, Yu-Na Kim, Jeong-Won Yoon, Dae-Gon Kim, Bo-In Noh, Jong-Woong Kim, Jung-Hoon Moon, Seung-Boo Jung
Materials Science & Engineering A, 2008.06

112

Reliability evaluation of Au-20Sn flip chip solder bump fabricated by sequential electroplating method with Sn and Au
Jeong-Won Yoon, Hyun-Suk Chun, Seung-Boo Jung
Materials Science & Engineering A, 2008

113

Characterization of Interfacial Reaction Layers Formed Between Sn-3.5Ag Solder and Electroless Ni-Immersion Au-Plated Cu Substrates
Han-Byul Kang, Jee-Hwan Bae, Jae-Wook Lee, Min-Ho Park, Jeong-Won Yoon, Seung-Boo Jung, Cheol-Woong Yang
Journal of Electronic Materials, 2008

114

Effect of surface finish on interfacial reactions of Cu/Sn-Ag-Cu/Cu(ENIG) sandwich solder joints
Jeong-Won Yoon, Seung-Boo Jung
Journal of Alloys and Compounds, 2008

115

Fabrication of Ni Metal Mask with Fine Pitch by Electroforming Process
Jun Hyung Lim, Eui Cheol Park, Seung-Yi Lee, Jeong-Won Yoon, Sang-Su Ha, Jinho Joo, Hoo-Jeong Lee, Seung-Boo Jung, Keun Song
Journal of Electronic Materials, 2007.11

116

Reliability of Nickel Flip Chip Bump with Tin-Silver Encapsulation on Copper/Tin-Silver Substrate during Bonding Process
Ja-Myeong Koo, Yu-Na Kim, Jeong-Won Yoon, Sang-Su Ha, Seung-Boo Jung
Microelectronic Engineering, 2007.11

117

Interfacial reaction and joint reliability of fine-pitch flip-chip solder bump using stencil printing method
Sang-Su Ha, Dae-Gon Kim, Jong-Woong Kim, Jeong-Won Yoon, Seung-Boo Jung
Microelectronic Engineering, 2007.11

118

Investigation of interfacial reaction between Au-Sn solder and Kovar for hermetic sealing application
Jeong-Won Yoon, Seung-Boo Jung
Microelectronic Engineering, 2007.11

119

Characteristic evaluation of electroless nickel-phosphorus deposits with different phosphorus contents
Jeong-Won Yoon, Jong-Hyun Park, Chang-Chae Shur, Seung-Boo Jung
Microelectronic Engineering, 2007.11

120

Microstructural evolution and interfacial reactions of fluxless-bonded Au-20Sn/Cu solder joint during reflow and aging
Jeong-Won Yoon, Hyun-Suk Chun, Hoo-Jeong Lee, Seung-Boo Jung
Journal of Materials Research, 2007.10