발행물

전체 논문

398

121

Morphology, thermal stability and solderability of electroless nickel-phosphorus plating layer
Jeong-Won Yoon, Hyun-Suk Chun, Han-Byul Kang, Min-Ho Park, Cheol-Woong Yang, Hoo-Jeong Lee, Seung-Boo Jung
Surface Review and Letters, 2007.08

122

Au-Sn Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications
Jeong-Won Yoon, Hyun-Suk Chun, Ja-Myeong Koo, Seung-Boo Jung
Microsystem Technologies, 2007.07

123

Solid-state interfacial reactions between Sn-3.5Ag-0.7Cu solder and electroless Ni-immersion Au substrate during high temperature storage test
Hyun-Suk Chun, Jeong-Won Yoon, Seung-Boo Jung
Journal of Alloys and Compounds, 2007.07

124

Reliability analysis of Au-Sn flip-chip solder bump fabricated by co-electroplating
Jeong-Won Yoon, Hyun-Suk Chun, Seung-Boo Jung
Journal of Materials Research, 2007.05

125

Characterization of failure behaviors in anisotropic conductive interconnection
Jong-Woong Kim, Dae-Gon Kim, Ja-Myeong Koo, Jeong-Won Yoon, Sunglak Choi, Kyung-Sik Kim, Jae-Do Nam, Hoo-Jeong Lee, Jinho Joo, Seung-Boo Jung
Materials Transactions, 2007.05

126

Investigation of interfacial reactions between eutectic Sn-3.5Ag solder and ENIG-plated Cu substrate during aging at high temperature
Jeong-Won Yoon, Hyun-Suk Chun, Seung-Boo Jung
Journal of Materials Science: Materials in Electronics, 2007.05

127

Effect of High Temperature Storage Test on Reliability of Eutectic Sn-Cu/ENIG Solder Joint
Jeong-Won Yoon, Sang-Won Kim, Seung-Boo Jung
Materials Science and Technology, 2007.04

128

Solder joint reliability evaluation of Sn-Zn/Au/Ni/Cu ball-grid-array package during aging
Jeong-Won Yoon, Seung-Boo Jung
Materials Science & Engineering A, 2007.04

129

Microstructural evolution of Sn-rich Au-Sn/Ni flip chip solder joints under high temperature storage testing condition
Jeong-Won Yoon, Hyun-Suk Chun, Ja-Myeong Koo, Hoo-Jeong Lee, Seung-Boo Jung
Scripta Materialia, 2007.04

130

Interfacial reactions and joint strength of Sn-37Pb and Sn-3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150℃
Jeong-Won Yoon, Jun Hyung Lim, Won-Chul Moon, Hoo-Jeong Lee, Jinho Joo, Seung-Boo Jung
Journal of Materials Research, 2006.12